2.0W/m.k Silicone Thermal Pad - Thermal Gap Filling Materials-NFION

2.0W/M.K Silicone Thermal Pad

Product No:NF150-200
Thermal Conductivity: 2.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.3-15MM or Customized
Hardness:20-50 shore C
Flaming Rating: UL94 V-0
Certificates: RoHS,UL,Reach

Introduction

Silicone thermal pads NF150-200 is a gap filled material mainly used for heat conduction, shock absorption, noise elimination between electronic and shell, It’s good in flexibility, compressibility allowing it squeeze the air completely to achieve sufficient contacting, good viscosity，making convenient installation and not easy to fall off.

Features

Low Density: NF150-200 thermal silicone pads are designed with a lower density, which helps reduce weight and accommodates the requirements of lightweight product designs.

Low Hardness: With a soft material composition that is easily compressible, it can snugly adhere to uneven surfaces, ensuring excellent contact between heat sources and heat sinks.

High Thermal Conductivity: Containing efficient thermal conductive fillers, they facilitate rapid heat transfer, reducing interfacial thermal resistance and enhancing overall heat dissipation efficiency.

Insulation: While conducting heat, they maintain excellent electrical insulation properties, safeguarding electronic components from the risk of short circuits.

Compression and Resilience: Boasting good compressibility and rebound force, they retain their shape even after prolonged compression, adapting to minor displacements caused by temperature fluctuations or mechanical stresses.

Filling and Sealing: Thanks to their softness and ability to be cut to size, they effectively fill tiny gaps between heat-generating devices and heat sinks, excluding air, augmenting heat transfer, and providing sealing benefits.

Convenience and Stability: Easy to install, they can be repeatedly disassembled and reused, while maintaining stable physical and chemical properties under various environmental conditions, such as wide temperature ranges and humidity changes.

Vibration Damping and Noise Reduction: Thermal silicone pads also contribute to absorbing vibrations and noise, thereby protecting the internal structure and sensitive components of devices.

Application

Computer hardware: Fill the thermal interface between high-power semiconductor components such as cpus, Gpus, memory bars, and power modules and heat sinks.
Communication equipment: base stations, routers, switches and other communication equipment internal power modules, processors and other heating components heat dissipation.
Consumer electronics: Thermal management between heat sources such as processors, batteries, and LED displays inside tablets, smartphones, TVS, and game consoles and housing or cooling structures.
New energy technology: Heat dissipation solutions for electric vehicle battery management systems (BMS), charging piles, photovoltaic inverters and other power electronic devices.
Industrial control and automation equipment: inverter, servo drive, PLC and other industrial control system heat dissipation components.
Lighting industry: Driving power and heat dissipation of light source inside LED lamps.

Specification

Testing Item	Testing Value	Testing Method
Thickness(MM)	0.3-15MM or Customized	ASTM D374
Components	Silicone Rubber &Ceramics	--
Colour	Blue or Customized	Visual
Hardness (Shore C)	30±5	ASTM D2240
Density(G/M³)	2.6±0.1	ASTM D792
Tensile Strength(KN/M)	0.3	ASTM D412
Extensibility(%)	70	ASTM D374
Working Temperature(℃)	-40~200	EN344
Breakdown Voltage(KV)	>10	ASTM D149
Volume Resistivity(Ω·CM)	1.5×10¹²	ASTM D257
Dielectric Constant(@1MHz)	6	ASTM D150
Weight Loss ratio (%)	＜2.5	@200℃240H
Flaming Rating	V-0	UL-94
Thermal Conductivity(W/M.K)	2	ASTM D5470
1:The data of conductive interface sheet is just for reference. 2:Different thermal conductive pad has different application areas, 3.Any application solution question,welcome to check with our team. 4 Sheet size&shape can be cut as customized. 5.Adhesive and reinforce fiberglass can be added as requested.