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The dominant frequency of smart cellphone chips is getting higher and higher, which will generate excessive heat to undermine user experience , even imperil the hardware function. This attracts all mobile manufacturers great emphasis to design prospective schemes, like Xiaomi black shark series are equipped with a multi-level direct contact integrated hot and cold cooling system through copper foil with integral liquid in the middle slender; the Glory note10 adopts the nine thermal technology, rhythms a liquid cooling layer, graphite paste and pipe in addition; Meizu 16 also employs application of water cooling system with thermal silicone grease or thermal putty coated on the surface of the processor.
The application of heat dissipation technology in smart phones will become more and more important,to drive NFION to upgrade the field of thermal interface material and the research of new technology.
