Except for these,the material has better conformability, so it is softer and more malleable than thermal conductive putty pads, allowing it to better conform to irregular surfaces and small gaps. This results in more efficient heat transfer and lower thermal resistance compared to conventional thermal pads. This results in better heat transfer and cooling of electronic components.
Feature | Value | Unit | Test Method |
Part A Color | Light blue | -- | Visual |
Part B Color | White | -- | Visual |
Density | 2.9 (±0.5) | g/cc | ASTM D792 |
Mixing Ratio | 1:1 | -- | By weight or volume |
Cure Condition | 24 | H | 25℃ |
15 | Min | 100℃ | |
Thermal Conductivity | 3.0(±0.2) | W/m·K | ASTM D5470 |
Color | Blue | -- | Visual |
Thermal Impedance | ≤0.9 | ℃-in²/W | ASTM D5470 |
@20psi&1mm | |||
Hardness | 35 | Shore C | ASTM D2240 |
Tensile Strength | ≥0.15 | MPa | ASTM D412 |
Extension Rate | ≥70 | % | ASTM D412 |
Flammability Rating | V-0 | -- | UL 94 |
Working Temperature | -50~160 | ℃ | IEC 60068-2-14 |
Breakdown Voltage | ≥10 | Kv/mm | ASTM D149 |
Volume Resistivity | ≥1012 | Ω·cm | ASTM D257 |
Dielectric Constant | ≥2 | @1MHz | ASTM D150 |
Dielectric loss | ≤0.1 | @1MHz | ASTM D150 |