Nfion 1.5W/M.K one-part thermal conductive gel is a gap filling material, specially designed for uneven surface and irregular cavity.
Nfion 1.5W/M.K one-part thermally conductive gel has almost no hardness, is soft and has a strong surface affinity. It can be compressed into a very thin variety of shapes and spread on the surface of various types of non-smooth electronic components, significantly improving the heat transfer efficiency of electronic components.
Nfion 1.5W/M.K one-part thermally conductive gel has viscosity and adhesion, will not be oily and dry, and has very superior reliability.
1、No settlement, no flow, can fill any uneven gap;
2、Soft, no stress, can be compressed to 0.1 mm thin;
3、High thermal conductivity, low thermal resistance, good wettability;
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Grey or Customized | Visual |
Density | G/CC | 2.3 | ASTM D1475 |
Thermal Resistance | ℃*IN2/W | 0.18 | ASTM D5470 |
Extrusion Flow Rate | G/MIN | 35 | 2.54MM 90PSI |
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | EN344 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 1.5 | ASTM D5470 |