One-part Thermal Conductive Gel 1.5W/M.K
One-part Thermal Conductive Gel 1.5W/M.K

One-part Thermal Conductive Gel 1.5W/M.K

One-part Thermal Conductive Gel 1.5W/M.K
Conductivity:1.5W/M.K
Working Temperature:-40-200℃
Non Solidifying,High Reliability,Low thermal resistance
Certification : ROHS, REACH,UL,SGS,CTI,ISO9001,TS16949
Conductivity:1.5W/M.K
Working Temperature:-40-200℃
Non Solidifying,High Reliability,Low thermal resistance
Certification : ROHS, REACH,UL,SGS,CTI,ISO9001,TS16949
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One-part Thermal Conductive Gel 1.5W/M.K Apply For Quotation
Introduction

Nfion 1.5W/M.K one-part thermal conductive gel is a gap filling material, specially designed for uneven surface and irregular cavity.

Nfion 1.5W/M.K one-part thermally conductive gel has almost no hardness, is soft and has a strong surface affinity. It can be compressed into a very thin variety of shapes and spread on the surface of various types of non-smooth electronic components, significantly improving the heat transfer efficiency of electronic components.

Nfion 1.5W/M.K one-part thermally conductive gel has viscosity and adhesion, will not be oily and dry, and has very superior reliability.

Nfion 1.5W/M.K one-part thermal gel has a weak adhesion to the surface of the substrate and can be peeled off from the substrate. Therefore, the electronic components filled with it are reworkable.
Features

1、No settlement, no flow, can fill any uneven gap;

2、Soft, no stress, can be compressed to 0.1 mm thin;

3、High thermal conductivity, low thermal resistance, good wettability;

4、The design and application are convenient, and the automatic dispensing can adjust the size of any thickness.
Application
Communication equipment, network terminal, storage equipment, LED , consumer electronics, power device, security equipment, instrument and meter, electrical engineering device, automotive electronics.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - Grey or Customized Visual
Density G/CC 2.3 ASTM D1475
Thermal Resistance ℃*IN2/W 0.18 ASTM D5470
Extrusion Flow Rate G/MIN 35 2.54MM 90PSI
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 EN344
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 1.5 ASTM D5470
SpecificationsBrochure
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