One-part Thermal Conductive Gel 4.0W/M.K

Conductivity：4.0W/M.K
Working Temperature：-40-200℃
Non Solidifying,High Reliability,Low thermal resistance
Certification : ROHS, REACH,UL,SGS,CTI,ISO9001,TS16949

Introduction

Nfion 4.0W/M.K one-part thermal conductive gel is a kind of thermal conductive gap filling material based on soft silicone resin. It has low interface thermal resistance, high thermal conductivity and good thixotropy. It is an ideal material for applications with large gap tolerance at present. The common usage of 4.0W/M.K one-part thermal conductive gel is to fill between the electronic components that need to be cooled and the heat sink, so that it can be in close contact, eliminate the air between the interfaces, reduce the thermal resistance, and quickly and effectively reduce the temperature of electronic components, so as to prolong the service life of electronic components and improve their reliability.

Features

High thermal conductivity, low thermal resistance, excellent wettability

Soft, stress free, infinitely compressible to the thinnest 0.1mm

No settlement, no flow, and can fill any uneven gap

Meet RoHS and UL environmental requirements

Application

Smart phones, tablets, laptops, drones, communication devices, network terminal devices, smart home products

Specification

Testing Item	Unit	Testing Value	Testing Method
Component	-	Silicone&Thermal Powder	-
Colour	-	White or Customized	Visual
Density	G/CC	3.2(±0.5)	ASTM D 792
viscosity	( mPa.s@25℃)	80*10⁴	Rheometer DHR-2
Thermal Resistance	℃*IN²/W	0.1	ASTM D5470
Extrusion Flow Rate	G/MIN	20	g/min(50MPa)
Extrusion Flow Rate	G/MIN	30	g/min(100MPa)
Weight Loss	%	＜0.5	@200℃240H
Voltage Resistivity	Ω·CM	>1*10¹³	ASTM D257
Working Temperature	℃	-40~200	IEC 60068-2-14
Mini interface Thickness	MM	0.09	-
Flammability	-	V-0	UL 94
Thermal Conductivity	W/M.K	4.0	ASTM D5470