Nfion 2.0W/M.K one-part thermally conductive gel is a high-performance thermally conductive material with extremely low deformation force, with plasticine-like plasticity, no flow, high thermal conductivity, low thermal resistance, good fit on heat dissipation components, insulation, It can automatically fill the gap, maximize the limited contact area, and can be infinitely compressed, which is suitable for heat dissipation modules or electronic components with large thickness changes. Different from thermal grease, Nfion 2.0W/M.K one-part thermal conductive gel has no sedimentation and no flow phenomenon. It is suitable for screen printing or blade coating. Syringe packaging can be dispensed on standard dispensing equipment. High operational convenience and efficiency.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Pink or Customized | Visual |
Density | G/CC | 2.6(±0.5) | ASTM D 792 |
Thermal Resistance | ℃*IN2/W | 0.15 | ASTM D5470 |
Extrusion Flow Rate | G/MIN | 25 | g/min(50MPa) |
40 | g/min(100MPa) | ||
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | IEC 60068-2-14 |
Breakdown Voltage | K v/mm | ≥7 | ASTM D 149 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 2.0 | ASTM D5470 |