One-part Thermal Conductive Gel 2.0W/M.K
One-part Thermal Conductive Gel 2.0W/M.K

One-part Thermal Conductive Gel 2.0W/M.K

One-part Thermal Conductive Gel 2.0W/M.K
Conductivity:2.0W/M.K
Working Temperature:-40-200℃
Non Solidifying,High Reliability,Low thermal resistance
Certification : ROHS, REACH,UL,SGS,CTI,ISO9001,TS16949
Conductivity:2.0W/M.K
Working Temperature:-40-200℃
Non Solidifying,High Reliability,Low thermal resistance
Certification : ROHS, REACH,UL,SGS,CTI,ISO9001,TS16949
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One-part Thermal Conductive Gel 2.0W/M.K Apply For Quotation
Introduction

Nfion 2.0W/M.K one-part thermally conductive gel is a  high-performance thermally conductive material with extremely low deformation force, with plasticine-like plasticity, no flow, high thermal conductivity, low thermal resistance, good fit on heat dissipation components, insulation, It can automatically fill the gap, maximize the limited contact area, and can be infinitely compressed, which is suitable for heat dissipation modules or electronic components with large thickness changes. Different from thermal grease, Nfion 2.0W/M.K one-part thermal conductive gel has no sedimentation and no flow phenomenon. It is suitable for screen printing or blade coating. Syringe packaging can be dispensed on standard dispensing equipment. High operational convenience and efficiency.





Features
1.Can be used directly
2.Non-solidify
3.Strong mechanical property and weather resistance
4.Filled various irregular structural gap completely
5. Good insulation

Application
Communication equipment, network terminal, storage equipment, LED , consumer electronics, power device, security equipment, instrument and meter, electrical engineering device, automotive electronics
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - Pink or Customized Visual
Density G/CC 2.6(±0.5) ASTM D 792
Thermal Resistance ℃*IN2/W 0.15 ASTM D5470
Extrusion Flow Rate G/MIN 25 g/min(50MPa)
40 g/min(100MPa)
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 IEC 60068-2-14
Breakdown Voltage K v/mm ≥7 ASTM D 149
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 2.0 ASTM D5470
SpecificationsBrochure
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  • Data
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